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YG163 Electronic Microsphere Debonding Experimental Tester:
              About our product：
              
			  The electronic microsphere debonding experiment tester is used to test the pull-out force of the symmetrical resin microspheres vertically embedded in the fiber, and estimate the bonding strength of the fiber-resin interface through the bonding length or bonding area.
              
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Product details
【Scope of application】The electronic microsphere debonding experiment tester is used to test the pull-out force of the symmetrical resin microspheres vertically embedded in the fiber, and estimate the bonding strength of the fiber-resin interface through the bonding length or bonding area.

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Mobile Phone: 15988761987 (Manager Sun)

Email address: jigaotest@163.com

Machine: 0577-86387100

Address: No. 1, Fudebao Road, Gaoxiang Industrial Zone, Xinqiao Street, Ouhai District, Wenzhou, Zhejiang

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Wenzhou Jigao

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YG163 Electronic Microsphere Debonding Experimental Tester:

About our product：

The electronic microsphere debonding experiment tester is used to test the pull-out force of the symmetrical resin microspheres vertically embedded in the fiber, and estimate the bonding strength of the fiber-resin interface through the bonding length or bonding area.